PCBA SMT patch processing

PCBA SMT patch process:

1. It is necessary to prepare the PCB board that meets the requirements, which includes the design, manufacture, cutting, drilling and other preliminary work of the PCB.

2. Component preparation: According to the circuit design requirements, prepare the corresponding electronic components and check to ensure that their quality and performance meet the standards.

3. Solder paste printing: Print a thin layer of solder paste on the pad of the PCB to prepare for subsequent welding.

4. Component placement: Use a high-precision placement machine to accurately place electronic components on the specified position of the PCB.

5. Reflow soldering: Place the PCB with mounted components into the reflow soldering oven, heat it to melt the solder paste and fix the components to achieve electrical connection.

6. Quality inspection: Use automatic optical inspection equipment (AOI) to check the soldering quality to ensure there are no quality problems such as leaking soldering and cold soldering.

7. Repair and packaging: Repair the defective products detected, and package and store the qualified products.