Thick copper PCB
Product Category: Thick Copper PCB
Number of Layers: 1-32 (or higher in special stack-up)
Copper Block: 3 to 20 oz (custom quote is higher)
Minimum Drill Size: 0.012"
Maximum Hole Aspect Ratio: 30:1
Controlled Impedance: + or - 10%
Surface Finish: HASL, OSP, immersion gold, immersion silver
Solder Mask Options: Green, blue, black, white, red, purple, yellow
Silk screen color: white, yellow, black
Final thickness: 0.020"–0.275"
Thick copper PCB, that is, thick copper printed circuit board, is a special type of PCB, whose main feature is that the thickness of the copper foil is greater than or equal to 2 ounces (about 70μm).
Features of Thick Copper PCB:
1. High conductivity:Thick copper foil can carry larger current and meet the requirements of high current and high voltage.
2. Good heat dissipation:Thick copper foil can effectively reduce the temperature of the circuit board and improve the working efficiency and stability of electronic products.
3. High mechanical strength:Thick copper foil enhances the mechanical strength of the circuit board, enabling it to withstand greater mechanical stress.
4. High reliability:Thick copper PCB can still maintain stable circuit design and signal transmission in harsh environments (such as high temperature, low temperature, corrosion, etc.).
Thick copper PCB, that is, thick copper printed circuit board, is a special type of PCB, whose main feature is that the thickness of the copper foil is greater than or equal to 2 ounces (about 70μm).
Features of Thick Copper PCB:
1. High conductivity:Thick copper foil can carry larger current and meet the requirements of high current and high voltage.
2. Good heat dissipation:Thick copper foil can effectively reduce the temperature of the circuit board and improve the working efficiency and stability of electronic products.
3. High mechanical strength:Thick copper foil enhances the mechanical strength of the circuit board, enabling it to withstand greater mechanical stress.
4. High reliability:Thick copper PCB can still maintain stable circuit design and signal transmission in harsh environments (such as high temperature, low temperature, corrosion, etc.).
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